En
Program Overview
Smartwin Manufacturing Technology offers direct drive transmission solutions for processes such as wafer dicing, wafer splitting, chip packaging, testing, and fiber coupling.
LDI Exposure System Precision Marble Linear Motor Application Solution
Wafer Assembly and Inspection Equipment Application Solution
Wafer Bottom Filling Spray Adhesive Application Solution
LDI Exposure System Precision Marble Linear Motor Application Solution
Solution Features: The solution uses Smartwin's coreless linear motors, capable of achieving motion axis speed fluctuations within one-thousandth of a millimeter. ACS motion control enhances the overall equipment stability. A professional assembly and design team ensures steady progress of the solution. Renishaw laser interferometers provide motion accuracy reports.
Industry: Semiconductor
Equipment Name: LDI Exposure System
Industry Applications: Outer layer of printed circuit boards (PCBs), flexible PCBs, etc.
Operating Environment: Constant temperature workshop
Structure: Marble gantry
Configuration Details: KYAC4000 series motors, RSF optical encoders, Rexroth/THK rails, ACS motion controller
Download Product Manual
Service Support
Call:+86 400 807 1566 Related parameters
Wafer Assembly and Inspection Equipment Application Solution
Features of the Solution: The multi-actuator design concept enables independent motion control, improving production efficiency while saving equipment space. The use of linear motors with a non-contact structure meets the requirements for cleanroom environments. The high-precision structure with grating compensation ensures the accuracy of motion required by vision systems, enhancing production yield.
Industry: Semiconductor
Equipment Name: Wafer Assembly and Inspection Equipment
Industry Application: Wafer Packaging
Operating Environment: Standard Temperature Workshop
Structure: Multi-Actuator Structure
Configuration Description: CFB065 Series Motors, Smartwin Encoders, Smartwin Rails, Smartwin Drivers
Related parameters
Wafer Bottom Filling Spray Adhesive Application Solution
Solution Features: The special structural design is lightweight and compact, utilizing linear motors to reduce motion inertia and achieve smooth operation. The non-contact design meets the dust-free environment requirements. The high-precision grating compensation structure ensures accurate motion for visual systems, improving production yield.
Industry: Semiconductor
Equipment Name: Bottom Filling Glue Spraying Machine
Industry Application: FCBGA Packaging, FCCSP Packaging, SIP Packaging
Operating Environment: Constant Temperature Workshop
Structure: Single-Drive Gantry Structure
Configuration: KYAC4000/CFB065 Series Motors, Smartwin Encoder, THK Guides, Smartwin Drivers